technology

Technology

Glue-less, consumable-free – “Gecko”- Wafer Carrier Technology

  • Based on the self-adhesive effect, like e.g. forged from the gecko-feets, we are realizing consuamble-free, most-ease-to-use, lowest CoO carriers enabling TSV-thin-wafer-3D processing, applicable for single/multiple wafer processing steps, wafer frontside/backside protection, enabling yield improvement, etc.
  • wet processing / high temperature compatible – carriers / etc.
  • rigid/semi-rigid carriers for various substrate applications

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Metrology

  • thin – wafer metrology
  • fast/contactless/full area inspection