Glue-less, consumable-free – “Gecko”- Wafer Carrier Technology
- Based on the self-adhesive effect, like e.g. forged from the gecko-feets, we are realizing consuamble-free, most-ease-to-use, lowest CoO carriers enabling TSV-thin-wafer-3D processing, applicable for single/multiple wafer processing steps, wafer frontside/backside protection, enabling yield improvement, etc.
- wet processing / high temperature compatible – carriers / etc.
- rigid/semi-rigid carriers for various substrate applications
- thin – wafer metrology
- fast/contactless/full area inspection